We have just introduced our new Pro Series line of SOIC/TSSOP to DIP adapter boards.
They are currently available in 14, 16, 20, 24 and 28-pin versions and are designed to mount an SOIC or TSSOP device and adapt it to a standard 0.1″ pin spacing as found on a solderless or soldered type breadboard. This allows you to work with SOIC or TSSOP packaged devices with your breadboards. Other package types may also be supported. Check out the pad sizes and spacing to determine suitability for mounting other package types.
The boards are double-sided with a SOIC footprint with 1.27mm lead spacing on one side and TSSOP footprint with 0.65mm lead spacing on the other side. The header pins can be soldered to either side of the board depending on how it will be used.
Finish is high quality ENIG (Electroless Nickle Immersion Gold) on 0.062″ FR-4 substrate.
These are also optionally available with machined round (Swiss style) gold plated header pins for use with machined round female header strips or IC sockets. They can also be used with standard male headers.
Check out our PCB products for more details.
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