This adapter has an ENIG finish and can mount a 16-pin SOIC-16 IC on one side or a TSSOP-16 IC on the other side and convert it to a 0.5″ wide DIP-16 footprint. It comes with machined round pins.
- Qty 1 – PCB, SOIC/TSSOP-16 to DIP Adapter, ENIG
- Qty 2 – 1×8 Machined Round Pins
KEY FEATURES OF PCB, SOIC/TSSOP-16 TO DIP ADAPTER ENIG WITH PINS:
- Mounts SOIC-16, TSSOP-16 and similar package types
- ENIG (Electroless Nickel Immersion Gold) finish
- Trace width 0.010″ with 0.020″ width on corner pins
- 1.6mm / 0.62″ FR-4 construction
- Includes machined round gold plated pins (Swiss machined pin) headers
This adapter board can mount a 16-pin SMD component that either have a 0.65mm or a 1.27mm lead spacing and convert it to a 16-pin 0.5″ DIP footprint with pins on standard 2.54mm (0.1″) centers for use with breadboards and perf boards. It is designed for SOIC-16 and TSSOP-16 packages, but it may fit other packages such as SSOP that share the same lead pitch. Refer to the pad dimensions to determine suitability for mounting a particular package type.
You can also mount packages with fewer than 16 pins on the adapter, but keep in mind that the pinout will not be 1:1.
The board is double-sided to support the two different SMD pin pitches. The header pins can be soldered to either side of the board and are typically used with machined round female headers or can be soldered to a PCB board.
Please note that the DIP footprint is on 0.5″ centers.
High Quality Finish
The board is constructed of 1.6mm FR-4 with 1oz copper and green solder mask. A 0.010″ trace width is used with heavier duty 0.020″ traces on the corner pins which normally carry power and ground connections.
The copper has an ENIG (Electroless Nickel Immersion Gold) finish for maximum performance. ENIG ensures extended shelf life against corrosion and provides excellent solderability with lead or lead-free solder. It also provides a completely flat soldering surface which is important with surface mount ICs and is fully ROHS compliant.
|Material||FR-4 w/ green solder mask|
|Plating||ENIG (Electroless Nickel Immersion Gold)|
|Dimensions||Board outline||20.82 x 15.62mm (0.82 x 0.615″)|
|Board thickness||1.6mm (0.062″)|
|Header row spacing||2.54mm (0.1″) pin-to-pin on 12.7mm (0.5″) centers|