PCB, SOIC/TSSOP-28 to DIP Adapter Panelized, Naked, 2oz Cu

Description

Our standard 28-pin SOIC-28 IC adapter but in panel format with the solder mask and silkscreen removed.  2oz copper.

PACKAGE INCLUDES:

• Qty 1 – PCB Panel 4×8 of SOIC/TSSOP-28 to DIP Adapter, No Solder Mask, 2oz Cu

KEY FEATURES OF PCB PANEL 4X8, SOIC/TSSOP-28 TO DIP ADAPTER:

• Mounts SOIC-28, TSSOP-28 and similar package types
• ENIG (ROHS) finish
• No Solder Resist
• No Silkscreen
• 2 oz copper
• 1.6mm / 0.62″ FR-4 construction
• No siderails

This adapter board can mount 28-pin SMD components that either have a 0.65mm or a 1.27mm lead spacing and convert it to a standard 28-pin 0.6″ DIP footprint with pins on 2.54mm (0.1″) centers for use with breadboards, perf boards and IC sockets.  It is designed for SOIC-28 and TSSOP-28 packages, but it may fit other packages such as SSOP that share the same lead pitch.  Refer to the pad dimensions to determine suitability for mounting a particular package type.

You can also mount packages with fewer than 28 pins on the adapter, but keep in mind that the pinout will not be 1:1.

The board is double-sided to support the two different SMD pin pitches.  The header pins can be soldered to either side of the board for use with breadboards and they can be inserted into sockets if desired.

The DIP footprint is 0.6″ centers.  These boards can be used with standard straight male headers available separately or they can be ordered with high quality round machine pin headers that work especially well for inserting into sockets and can be used with the high quality round machine pin female sockets that come on break-away strips.

High Quality Finish

The boards are constructed of 1.6mm FR-4 with 2oz copper.  A 0.010″ trace width is used with heavier duty 0.020″ traces on the corner pins which normally carry power and ground connections.

The copper has an ENIG (ROHS compliant) finish for good performance vs cost tradeoff.

Notes: 

1. None

Technical Specifications